The increase in requirements for electronic circuit miniaturization in microelectronic devices is expected to drive the growth of the global market for embedded die packaging technology. The Asia Pacific region contributed the largest share in 2020, and its dominant share in terms of revenue is expected to continue to 2030. The global economy was turbulent due to the unprecedented situation of the epidemic, and the mold packaging technology market was negatively affected, especially in the early stages.
PORTLAND, Oregon, June 2, 2022 (GLOBE NEWSWIRE) – According to the report published by Allied Market Research, Global Compact Packaging Technology Market Generated $63.93 million in 2020, and is estimated to generate $311.41 million by 2030, experiencing a compound annual growth rate of 18.2% from 2021 to 2030. The report provides a detailed analysis of changing market trends, value chain, top sectors and key investment pockets, and regional scenarios, and the competitive landscape.
The increase in the requirements for electronic circuit miniaturization in microelectronic devices is driving the growth of the global market for embedded die packaging technology. However, high initial costs of compact mold packaging hamper market growth. On the other hand, the increase in the adoption of smartphones and wearable devices creates new opportunities in the coming years.
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The global economy has been turbulent due to the unprecedented situation of the epidemic, and the combined mold packaging technology market has been adversely affected, especially in the early stages.
Production facilities have slowed down as a result of the Covid-19 pandemic, which in turn has improved the demand for electronics and semiconductor products in these industries. Its main repercussions include a major halt in manufacturing in Europe and a halt in Chinese material exports, both of which impede the expansion of the inline packaging technology market.
The report provides a detailed segmentation of the global Embedded Packaging Technology market based on platform, industry segment, and region.
Based on the platform, the template included at the bottom of the IC package retained the extension The highest market share In 2020, it accounts for nearly half of the total share, and is expected to maintain its leadership position during the forecast period. However, mold embedded in the flexible sheet segment is estimated to grow at the fastest compound annual growth rate of 20.4% from 2021 to 2030.
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Based on industry segment, the consumer electronics segment captured the largest share in 2020, contributing nearly half of the global embedded mold packaging technology market, and is expected to maintain its leading position during the forecast period. However, the healthcare sector is expected to depict the highest compound annual growth rate of 21.2% from 2021 to 2030.
Based on region, the Asia Pacific region contributed the largest share in 2020, accounting for about half of the total share, and its dominant share in terms of revenue is expected to continue to 2030. Moreover, this same segment is expected to show the largest annual growth rate Composite at 19.7% during the forecast period.
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The leading players in the global market for inline mold packaging technology discussed in the research include Taiwan Semiconductor Manufacturing Company, Amkor Technology, AT&S, and ASE Group. General Electric, Fujikura, Infineon, Microsim, Schweitzer and TDK Epcos.
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